The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2004
Filed:
Apr. 11, 2001
Yutaka Koshiba, Tokyo, JP;
Tutomu Masui, Osaka, JP;
Kazumasa Hori, Osaka, JP;
Yoshiaki Hattori, Osaka, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Abstract
An adhesion-resistant oxygen-free roughly drawn copper wire having an oxygen concentration of 1 to 10 ppm and a hydrogen concentration of 1 ppm or less, has a surface oxide film having a total thickness of 50 to 500 angstroms, in which 0.2 to 90% of the total thickness of the oxide film is Cu O. The adhesion-resistant oxygen-free roughly drawn copper wire is prepared using a continuous casting process, in which the molten copper is agitated and dehydrogenated in a casting trough containing weirs, and the thickness of the oxide layer is controlled by alcohol cleaning the cast copper bar material prior to rolling.