The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2004
Filed:
Feb. 28, 2002
Hermann Bichler, Rohrbach, DE;
Reinhard Hanzlik, Freising, DE;
Frank Mueller, Freising, DE;
Stefan Fries, Landshut, DE;
Helmut Endl, Freising, DE;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A chamber ( ) for applying material to the surface of a semiconductor wafer ( ) located in the chamber by means of cathodic sputtering a target ( ), located on a target mount ( ), of the material to be applied or a component thereof, contains a wafer mount ( ) on which the semiconductor wafer ( ) to be coated is located. The wafer mount ( ) is provided movable in the chamber ( ) between a charging position for application of the semiconductor wafer and a sputtering position in which semiconductor wafer is located at a predefined distance away from and opposite to the target. Provided in the chamber is a shielding support ( ) which is supported by the edge of the semiconductor wafer in the sputtering position in maintaining it in contact with the wafer mount, the shielding support extending between the edge of the semiconductor wafer and a portion adjoining the edge of the target on the target mount and thus defining a sputtering space between the target and the semiconductor wafer.