The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2004
Filed:
Jul. 29, 2002
Frank Meyer, Dresden, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A method for characterizing planarizing properties of a selected expendable material combination in a chemical-mechanical polishing process includes steps of: providing a combination of expendable materials including a softcloth and a polishing agent; providing test substrates with test patterns with different feature densities; performing a polishing process for each of the test substrates while the respective combination of the values for the processing parameters (pressure and velocity) is maintained until saturation is achieved; determining a characteristic quantity for the global grade level from the test substrates that have been polished; and determining expendable material parameters that characterize the planarizing properties for the selected expendable material combination from a functional relationship between the characteristic quantity for the global grade level to a quotient of the relative velocity and the pressure for each one of the test substrates.