The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2004

Filed:

Jan. 09, 2003
Applicant:
Inventors:

Jackson Hsieh, Hsinchu Hsien, TW;

Jichen Wu, Hsinchu Hsien, TW;

Bruce Chen, Hsinchu Hsien, TW;

Assignee:

Kingpak Technology Inc., Hsinchu Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/302 ;
Abstract

An image sensor to be mounted to a printed circuit board. The module includes a substrate, an integrated circuit, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate is composed of metal sheets arranged in a matrix, and a middle board positioned in a central region surrounded by the metal sheets. Each metal sheet has a first board and a second board connected to the printed circuit board. A slot is formed under the substrate. The integrated circuit is arranged within the slot and electrically connected to the substrate. The chip is placed on the middle board. The wires electrically connect the first boards, to the chip. The transparent layer is placed on the frame layer to cover the chip.


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