The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2004

Filed:

Jun. 29, 2001
Applicant:
Inventors:

Arvind Kamath, Mountain View, CA (US);

Rajiv L. Patel, San Jose, CA (US);

Assignee:

LSI Logic Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1425 ; H01L 2/1336 ; H01L 2/176 ;
U.S. Cl.
CPC ...
H01L 2/1425 ; H01L 2/1336 ; H01L 2/176 ;
Abstract

A method for forming shallow junctions in a substrate. The substrate is masked with a first mask to selectively cover first portions of the substrate and selectively expose second portions of the substrate. A first dopant is implanted substantially within a first depth zone through the second portions of the substrate. The first depth zone extends from a first depth to a second depth, and the first depth is shallower than the second depth. The substrate is annealed for a first time to form a noncontiguous buried insulating layer substantially within the first depth zone in the second portions of the substrate. The substrate is masked with a second mask to selectively cover third portions of the substrate and selectively expose fourth portions of the substrate. The fourth portions of the substrate at least partially overlap the second portions of the substrate. A second dopant is implanted substantially within a second depth zone through the fourth portions of the substrate. The second depth zone extends from an upper surface of the substrate to the first depth. The substrate is annealed for a second time to activate the shallow junctions formed substantially within the second depth zone in the fourth portions of the substrate. The shallow junctions have a depth that is substantially limited by the noncontiguous buried insulating layer that starts at the first depth.


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