The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2004
Filed:
Nov. 07, 2002
Yea-Zan Su, Hsin-Chu, TW;
Cheng-Chung Huang, Jubei, TW;
Huai-Jen Hsu, Hsinchu, TW;
Wen-Tsan Chang, Hsin Chu, TW;
Taiwan Semiconductor Manufacturing Company, Hsin-Chu, TW;
Abstract
A method of forming a bond pad structure reinforced with insulator spacers located on the sides of the bond pad structure has been developed. The method features formation of an aluminum based bond pad structure located overlying and contacting a top portion of a metal interconnect structure exposed in an opening in an intermetal dielectric layer. After deposition of an insulator layer such as silicon nitride or silicon oxide, an anisotropic dry etch procedure is employed to define the insulator spacers on the sides of the bond pad structure. The presence of insulator spacers on the sides of the bond pad structure reduces the risk of bond pad damage which can occur during subsequent pre-wire bonding dicing and transportation procedures.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile