The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2004
Filed:
Apr. 15, 2002
Applicant:
Inventor:
Chih Ming Chung, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/150 ;
Abstract
This invention provides a method for manufacturing a semiconductor chip package which mainly utilizes a substrate having a organic surface protection thereon to package a central-pad chip. In the encapsulating process, since the molding flash is completely formed on the surface of the organic surface protection, the molding flash can be easily removed together with the organic surface protection without damaging the substrate surface. This invention further provides a method for manufacturing the substrate.