The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2003
Filed:
Jan. 30, 2002
Chuichi Miyazaki, Akishima, JP;
Yukiharu Akiyama, Koganei, JP;
Masanori Shibamoto, Urawa, JP;
Tomoaki Kudaishi, Kodaira, JP;
Ichiro Anjoh, Koganei, JP;
Kunihiko Nishi, Kokubunji, JP;
Asao Nishimura, Kokubunji, JP;
Hideki Tanaka, Sagamihara, JP;
Ryosuke Kimoto, Hamura, JP;
Kunihiro Tsubosaki, Hino, JP;
Akio Hasebe, Higashimurayama, JP;
Other;
Abstract
A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.