The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2003

Filed:

Dec. 21, 2001
Applicant:
Inventors:

Masataka Watanabe, Niigata-ken, JP;

Satoshi Okazaki, Niigata-ken, JP;

Hideo Kaneko, Niigata-ken, JP;

Ken Ohashi, Fukui-ken, JP;

Hideki Kobayashi, Fukui-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 1/435 ;
U.S. Cl.
CPC ...
C23C 1/435 ;
Abstract

The present invention provides a magnetron sputtering system, which ensures a formation of a desired thin film, using a thick target. In the sputtering process, a portion of the target does not have erosion free portions. The present invention provides a magnetron sputtering system comprising a chamber for sputtering, a target electrode installed inside said chamber, a substrate electrode installed in the chamber opposite to the target electrode, a ring-shaped magnet installed so as to enclose the side surface of the target electrode, and a semi-circular disk shaped magnet installed opposite to the target-mounted surface of the target electrode, wherein the semi-circular disk shaped magnet is rotated in the circumferential direction of the target electrode and is magnetized in the direction perpendicular to the target electrode. This ensures a specific magnetic field component to be generated over the thick planar target surface


Find Patent Forward Citations

Loading…