The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2003

Filed:

Jul. 29, 2002
Applicant:
Inventors:

Seiichiro Kobayashi, Ome, JP;

Koichi Koyanagi, Ome, JP;

Teruo Honda, Ome, JP;

Hideo Saeki, Ome, JP;

Masaharu Motohashi, Ome, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/168 ; H01L 2/127 ;
U.S. Cl.
CPC ...
H01L 2/168 ; H01L 2/127 ;
Abstract

In a wafer chuck for flatly vacuum-chucking a semiconductor wafer ( ) supported by support pins ( ) such that a pressure in a suction chamber ( ) surrounded by an external wall ( ), the upper surface of the external wall ( ) is formed to be lower than the upper surfaces of the support pins, and the upper surface of the external wall ( ) does not pressure the semiconductor wafer ( ), a distance (L ) between the external wall ( ) and closest support pins ( ) is up to 1.8 mm, and an alignment pitch. (L ) of the support pins ( ) aligned inside the closest support pins ( ) to the external wall ( ) is not more than 1.5 times of the distance (L ) between the external wall ( ) and the closest support pins ( ).


Find Patent Forward Citations

Kobayashi, Seiichiro. (2003). Wafer chuck, exposure system, and method of manufacturing semiconductor device (U.S. Patent No. 6664549). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6664549

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…