The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2003
Filed:
Nov. 15, 2001
Applicant:
Inventors:
William A. Wojtczak, Santa Clara, CA (US);
Ma. Fatima Seijo, Hayward, CA (US);
David Bernhard, Dallas, TX (US);
Long Nguyen, San Jose, CA (US);
Assignee:
Advanced Technologies Materials, Inc., Danbury, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 9/04 ; B08B 6/00 ;
U.S. Cl.
CPC ...
C11D 9/04 ; B08B 6/00 ;
Abstract
A semiconductor wafer cleaning formulation, including 2-98% wt. organic amine, 0-50% wt. water, 0.1-60% wt. 1,3-dicarbonyl compound chelating agent, 0-25% wt. of additional different chelating agent(s), 0.5-40% wt. nitrogen-containing carboxylic acid or an imine, and 2-98% wt polar organic solvent. The formulations are useful to remove residue from wafers following a resist plasma ashing step, such as inorganic residue from semiconductor wafers containing delicate copper interconnecting structures.