The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2003
Filed:
Aug. 17, 2000
John Briar, Singapore, SG;
St Assembly Test Services Pte Ltd., Singapore, SG;
Abstract
In accordance with the objectives of the invention a new method is provided to insert the underfill for flip-chip semiconductor devices. An IC chip is provided with solder bumps. The flip-chip is entered into an enclosed space, the heatsink forms the top of the enclosed space, the substrate forms the bottom of the enclosed space. The enclosed space is filled with a mold compound. This mold compound now surrounds the IC chip thereby including the area below the IC. The step of inserting the underfill as a separate processing step has thereby been eliminated.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile