The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2003

Filed:

Feb. 07, 2000
Applicant:
Inventors:

Junichi Hikita, Kyoto, JP;

Katsumi Sameshima, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
Abstract

A semiconductor chip having a semiconductor substrate; a surface protective film covering the semiconductor substrate; and an interconnection having a portion exposed on the surface protective film, at least the exposed portion of the interconnection being composed of an oxidation-resistant metal material. The interconnection includes, for example, an internal interconnection at least partly exposed from the surface protective film, and a metal coating film of the oxidation-resistant metal material covering a surface portion of the internal interconnection exposed from the surface protective film. The interconnection may be a surface interconnection of the oxidation-resistant metal material provided on the surface protective film.


Find Patent Forward Citations

Hikita, Junichi. (2003). Semiconductor chip and semiconductor device of chip-on-chip structure (U.S. Patent No. 6657309). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6657309

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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