The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2003
Filed:
May. 08, 2001
Kian Chai Lee, Singapore, SG;
Teoh Bee Yong Tim, Singapore, SG;
Vijendran M, Singapore, SG;
Lien Wah Choong, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
A method and apparatus for distributing a mold material in a mold for packaging microelectronic devices. In one embodiment, the microelectronic devices are placed on a substrate and the substrate is at least partially enclosed by the device region of a mold cavity. A mold material is passed along a flow axis through at least one entrance port into an intermediate region of the mold. The mold material is then passed from the intermediate region into the device region through a single opening spaced apart from and positioned between the entrance port and the microelectronic device. The single opening has a flow area transverse to the flow axis smaller than a flow area immediately upstream of the single opening to restrict the flow through the single opening. The mold material can accordingly form a uniform leading edge as it exits the opening and before it impinges on the microelectronic device.