The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2003

Filed:

Feb. 16, 2001
Applicant:
Inventors:

James W. Adkisson, Jericho, VT (US);

Edward Maciejewski, Wappingers Falls, NY (US);

Peter Smeys, White Plains, NY (US);

Anthony K. Stamper, Williston, VT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/900 ;
U.S. Cl.
CPC ...
H01L 2/900 ;
Abstract

Thermal degradation of a low-k organic dielectric material is avoided or limited in the proximity of a heat source such as a fusible element by overlaying the low-k material with a thermally conductive material and providing a low thermal resistance path from the thermally conductive material, possibly having a low modulus of elasticity, to a heat sink. The thermally conductive material thus provides crack-stop protection for further layers of an integrated circuit or interconnect structure above the fusible element by mechanical, chemical and thermal encapsulation of the heat source and low-k material.


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