The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2003

Filed:

Nov. 05, 2002
Applicant:
Inventors:

Shinji Ohuchi, Tokyo, JP;

Harufumi Kobayashi, Tokyo, JP;

Yasushi Shiraishi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract

A polyimide layer is formed over a semiconductor chip, a rewiring to be connected to each of the electrode pads of the semiconductor chip is formed over the polyimide layer, and a post serving as a terminal is connected to each of the electrode pads via the rewiring, thereby redisposing the electrode pads. A resin for encapsulating the rewirings and the posts is formed on the surface of the semiconductor chip to the extent equivalent to the dimension of the semiconductor chip, and in a groove formed in portions of the resin, around the respective posts, the topmost surface and the sidewall face of the respective posts are exposed out of the resin.


Find Patent Forward Citations

Ohuchi, Shinji. (2003). Method of fabricating resin-encapsulated semiconductor device (U.S. Patent No. 6653218). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6653218

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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