The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2003

Filed:

Jun. 28, 2000
Applicant:
Inventors:

Elke Zakel, D-14612 Falkensee, DE;

Rolf Aschenbrenner, Berlin, DE;

Frank Ansorge, Berlin, DE;

Paul Kasulke, Berlin, DE;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 1/900 ;
U.S. Cl.
CPC ...
G06K 1/900 ;
Abstract

The present invention relates to a method of producing a contactless chip card. In a first step of the method, a card body with one or a plurality of recesses on one card body side is produced from a theremoplastic material, preferably by injection moulding. Bumps being formed on the base surface of the recesses. Subsequently, conductor tracks corresponding to a coil as a conductor track pattern are impressed directly onto surface areas of the card body side including the recesses using a hot impressing technique. The conductor tracks are impressed especially also onto surface areas inside the recesses such that same extends across the bumps. One or a plurality of chips are then aligned in the recesses and contacted with the conductor tracks in the recesses which extend across the bumps. The method according to the present invention is advantageous insofar as it permits a simple production of a chip card, which requires only a few method steps and is therefore also economical. Furthermore, such a chip card is both mechanically stable and reliable, since it comprises very few individual layers and since the conductor tracks of the coil are applied directly to the card body.


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