The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2003
Filed:
Apr. 04, 2001
Applicant:
Inventors:
Makoto Ohkawa, Kariya, JP;
Takayuki Sugisaka, Okazaki, JP;
Shuichi Ito, Kariya, JP;
Hiroshi Tanaka, Toyokawa, JP;
Assignee:
Denso Corporation, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/1302 ;
U.S. Cl.
CPC ...
H01L 2/1302 ;
Abstract
When a barrier metal disposed on a thin film resistor material is wet-etched to expose the underlying thin film resistor material as a thin film resistor, the wet etching is performed at first and second steps. The first step is performed using H O /NH OH solution, and is stopped before the thin film resistor material is exposed. Then, the second step is performed using H O /H O solution until the thin film resistor material is exposed with a desired length, thereby forming the thin film resistor.