The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2003
Filed:
Nov. 27, 2001
Applicant:
Inventor:
Joachim Hoepfner, Planegg, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A method fabricates an integrated semiconductor product. The first step is providing a semiconductor wafer that has preformed semiconductor components. The next step is forming at least one connection, in particular a polysilicon connection. The next step is exposing the at least one connection from the wafer front surface. The next step is applying a protective layer, in particular a silicon nitride protective layer, to the wafer front surface. The next step is treating the wafer front surface by a chemical mechanical polishing (CMP) step, with the result that the at least one connection is made accessible again.