The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2003
Filed:
Feb. 28, 2001
Applicant:
Inventors:
Hiroyuki Hishinuma, Kanuma, JP;
Hideyuki Kurita, Yokohama, JP;
Ryo Ito, Kanuma, JP;
Masayuki Nakamura, Kanuma, JP;
Assignee:
Sony Chemicals Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 ; H05K 3/10 ;
U.S. Cl.
CPC ...
H05K 3/02 ; H05K 3/10 ;
Abstract
A process for manufacturing a flexible wiring board according to the present invention includes growing metal bumps ( ) using a mask film patterned by photolithography. Fine openings are formed in a polyimide film with good precision allowing fine metal bumps ( ) to be formed with good precision. After metal bumps ( ) have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps ( ).