The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2003

Filed:

Sep. 25, 2002
Applicant:
Inventors:

Heung Jae Cho, Kyoungki-do, KR;

Dae Gyu Park, Kyoungki-do, KR;

Kwan Yong Lim, Kyoungki-do, KR;

Assignee:

Hynix Semiconductor Inc., Kyoungki-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/13205 ;
U.S. Cl.
CPC ...
H01L 2/13205 ;
Abstract

CMOS device arrangements have a surface channel, and a method for manufacturing the same by forming a multi-layer that includes a first metal layer, a polysilicon layer and a second metal layer having a work function from 4.8 through 5.0 eV on a cell region NMOS and a gate electrode of a peripheral circuit region PMOS, and by forming a multi-layer that includes a polysilicon layer and a second metal layer on a gate electrode of a peripheral circuit region NMOS. Because of the multi-layered gate electrode, a separate transient ion implantation process is not necessary, which consequently simplified the CMOS manufacturing process, while maintaining the threshold voltage of each peripheral circuit region −0.5V and below, and the threshold voltage of the peripheral circuit region NMOS +0.5V and below. Meantime, since the cell NMOS has the threshold voltage of +1V thanks to the first metal layer, no separate back bias is necessary, thereby forming a device with low power consumption, which consequently improves characteristics, yield and reliability of the device.


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