The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2003
Filed:
Dec. 07, 2001
Kenji Yajima, Kitamoto, JP;
Norikazu Ishida, Osaka, JP;
Yutaka Koshiba, Tokyo, JP;
Keiji Nogami, Tokyo, JP;
Akihiro Kakimoto, Tokyo, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Abstract
A method and apparatus for manufacturing copper and/or copper alloy ingots having no shrinkage cavities and having smooth surfaces without wrinkles are provided. The apparatus comprises a bottom-casting type melting furnace and a heating furnace for heating a mold in which the molten metal is cast. The method comprises the steps of melting the material of copper and/or copper alloy, and casting the molten copper and/or molten copper alloy into a cylindrical mold which is placed on a cooled pedestal provided at the bottom of the heating furnace and the side wall of which is heated by the heating furnace so as to form a temperature gradient increasing from the bottom to the top of the mold.