The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2003
Filed:
Oct. 23, 2001
Yukiharu Akiyama, Koganei, JP;
Tomoaki Kudaishi, Kodaira, JP;
Takehiro Ohnishi, Higashimurayama, JP;
Noriou Shimada, Kodaira, JP;
Shuji Eguchi, Toukai-mura, JP;
Asao Nishimura, Kokubunji, JP;
Ichiro Anjo, Koganei, JP;
Kunihiro Tsubosaki, Hino, JP;
Chuichi Miyazaki, Akishima, JP;
Hiroshi Koyama, Tachikawa, JP;
Masanori Shibamoto, Urawa, JP;
Akira Nagai, Hitachi, JP;
Masahiko Ogino, Hitachi, JP;
Other;
Abstract
A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elastic body and having openings in areas where the connection terminals are situated; plural leads formed on the top surface of the insulating tape, one end of each lead being connected to one of the connection terminals and the other end being disposed on the elastic body; plural bump electrodes formed on the other ends of the plural leads; and a resin body for sealing the connection terminals and one end of each of the leads, wherein the insulating tape protrudes beyond the chip where the plural connection terminals are arranged, and wherein the shape of the resin body is restricted by the protruding part of the insulating tape.