The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2003
Filed:
Jul. 08, 2002
Joseph C. Sher, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
An integrated circuit die includes a bond pad connected to first and second input buffers in the die through laser fuses. In one operating configuration of the die, the die uses the first input buffer but does not use the second input buffer, so the laser fuse between the bond pad and the second input buffer is blown. In another operating configuration of the die, the die uses the second input buffer but does not use the first input buffer, so the laser fuse between the bond pad and the first input buffer is blown. As a result, the capacitive load on the bond pad is similar to the capacitive load on similar bond pads in the die connected to only one input buffer in the die. Thus, signals propagate into all the bond pads at about the same improved speed.