The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2003

Filed:

May. 03, 2001
Applicant:
Inventors:

Sreenivasan K. Koduri, Plano, TX (US);

David J. Bon, Plano, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05B 1/918 ; G06F 1/900 ; B23K 3/100 ; B23K 3/102 ;
U.S. Cl.
CPC ...
G05B 1/918 ; G06F 1/900 ; B23K 3/100 ; B23K 3/102 ;
Abstract

A computerized system and method for reducing bond program errors in a slave bonder, prepared to attach connecting bonds onto bond pads of a slave integrated circuit, by first collecting, on a master bonder, input data concerning bond x-y locations, alignment reference x-y locations, and alignment reference images from a master integrated circuit, then analyzing these data to construct a network of relationships between reference images and bond locations, and store data and relationships in a master file. Secondly, on a slave bonder, all this information is automatically retrieved and compared by a computer with input data concerning alignment reference images from a slave circuit. Thirdly, any discrepancy found is corrected by a computer to identify the new bond locations on the slave circuit. Finally, the slave bonder attaches the connecting bonds based on the computed correct bond locations.


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