The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2003
Filed:
Jul. 03, 2001
Emmanuel Perrin, Biviers, FR;
Herve Jaouen, Meylan, FR;
STMicroelectronics S.A., Montrouge, FR;
Abstract
A method of determining the time for polishing the surface of an integrated circuit wafer on a polishing machine. A sample wafer is fabricated to include at least one high plateau and at least one low plateau joined by a sudden transition. At least one initial profile is topographically scanned, and the surface of the sample wafer is polished at a particular polishing pressure for a particular polishing time. The final profile of the polished layer is topographically scanned in the corresponding area, and the initial and final topographical scans of the sample wafer are converted into Fourier series. The surface of the wafer to be polished is topographically scanned, and the topographic scan of the wafer to be polished is converted into a Fourier series. The time for polishing the wafer to be polished is calculated from the Fourier series and the average thickness to be removed.