The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2003
Filed:
Feb. 01, 2002
Shibaura Mechatronics Corporation, Yokohama, JP;
Abstract
An electric component compression bonding machine for bonding a plurality of electric components arranged in a row to a substrate is described. The bonding machine comprises: a pressure application tool for applying a pressure to the electric components; a pressure receiving tool located opposed to the pressure application tool; a substrate supporting tool for supporting the substrate between the pressure application tool and the pressure receiving tool; a moving unit for moving the substrate supported by the substrate supporting tool relative to the pressure application tool; a control unit connected to the moving unit and taking control of the moving unit in order to adjust the position of the substrate supported by the substrate supporting tool relative to the pressure application tool for compression bonding the electric components to the substrate by the pressure application tool, wherein the control unit controls the moving unit to adjust the position of the substrate supported by the substrate supporting tool relative to the pressure application tool in order that any one of the ends of the pressure application tool is positioned apart from the row of the electric components or positioned between adjacent ones of the electric components.