Wide data path stacking system and method

Abstract

Provided is a system and method for selectively stacking and interconnecting integrated circuit devices having a data path of n-bits to create a high-density integrated circuit module having a data path of greater than n-bits. Integrated circuits are vertically stacked one above the other. Where the constituent IC elements have a data path of n-bits in width, a module devised in accordance with a preferred embodiment of the present invention presents a data path 2n-bits wide. In a preferred embodiment, an interconnection frame comprised of printed circuit board material is disposed about two similarly oriented ICs to provide interconnectivity of the constituent ICs and concatenation of their respective data paths. An array of clip-leads or other connectors are appended to module connection pads to provide lead-like structures for connection of the module to its operating environment. In a two-high stack, address lines of the constituent ICs are interconnected, while the data lines of the respective ICs are concatenated to double the data path width of the stack relative to the data path width of the constituent ICs. In an alternative preferred embodiment, two facially juxtaposed TSOP ICs are surface mounted to an interconnection body laterally positioned between the ICs. The interconnection body has IC connection pads and a set of module connection pads for connection of the module. The interconnection body has a network of connections that interconnects the address lines of the constituent ICs and concatenates the data lines to double the data path width of the stack relative to the data path width of the ICs from which the stack is composed.