The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2003
Filed:
Sep. 28, 2001
Vassoudevane Lebonheur, Tempe, AZ (US);
Robert Starkston, Phoenix, AZ (US);
Intel Corporation, Santan Clara, CA (US);
Abstract
A microprocessor package and a method of dissipating heat therefrom have improved thermal performance by utilizing low modulus thermal interface material between the flip chip, central processing unit and a heat spreader in the package. A modulus of elasticity of the thermal interface material in the kPa range is preferably provided by a cured, filled polymer gel which is lightly crosslinked. The gel thermal interface material enables the package to have a post end-of-line and post reliability testing thermal resistance across the thermal interface material between the flip chip and the heat spreader of <0.45 cm ° C./Watt. Mitigation of thin film cracking in die and prevention of interfacial delamination upon temperature cycling are also attained.