The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2003
Filed:
Apr. 02, 2002
Hon Hai Precision Ind. Co., Ltd., Taipei Hsien, TW;
Abstract
A heat dissipation assembly includes a heat sink ( ), a backplate ( ), a plurality of bolts ( ) and springs ( ), and a PCB ( ). The PCB supports a chip ( ) thereon and defines a plurality of through holes ( ) around the chip. The backplate forms a plurality of posts ( ) engaged in the through holes. A plurality of cavities ( ) is defined in the post. The heat sink comprises a chassis ( ) and defines a plurality of fixing holes ( ) through the chassis. The bolts extend through the fixing holes of the heat sink and threadedly engaged in the cavities of the backplate to connect the heat sink to the printed circuit board. The springs are squeezed between the bolts and the chassis of the heat sink, for providing appropriate forces on the heat sink toward the chip.