The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2003
Filed:
Jan. 09, 2001
Applicant:
Inventors:
Michael S. Lacy, Pleasanton, CA (US);
John M. Boyd, Atascadero, CA (US);
Assignee:
Lam Research Corporation, Fremont, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 2/100 ;
U.S. Cl.
CPC ...
B24B 2/100 ;
Abstract
A method of producing a chemical mechanical planarization (CMP) polishing belt structure is disclosed that includes forming a strip of substantially rigid material into a support belt having an interior surface and an exterior surface. At least a portion of the exterior surface of the support belt is altered to form a plurality of gripping members integral with the exterior surface of the support belt. An interior surface of a seamless CMP belt is applied to the exterior surface of the support belt such that the plurality of gripping members engage the interior surface of the seamless CMP belt in a non-slip grip.