The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2003

Filed:

Jun. 15, 2000
Applicant:
Inventor:

Chanh Le, Tigard, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 1/3648 ;
U.S. Cl.
CPC ...
H01R 1/3648 ;
Abstract

A stacked dual socket system that is interchangeable with and has no larger footprint than a single USB compliant socket and which allows connector access to both USB channels. The stacked socket includes a first USB compliant socket and a second USB compliant socket. The second USB compliant socket is stacked on top of the first socket relative to the mother board so that the stacked has the same footprint on the mother board as a single USB compliant socket. Each socket has a linear array of four conductor pins that project downwardly from the bottom of the first socket within the footprint of the socket and makes contact with two separate arrays of electrical conductors in the mother board. The bottom of the first socket has four spaced apart legs that form the mechanical interface between the stacked socket and the mother board and which provide improved mechanical stability. An electrically conductive cowling encases all sides of both sockets except for the bottom and the front. A bridge section of the cowling passes across the front surface of the stacked socket from one side to the other between the openings into the two sockets. The section of the cowling has one or more finger elements that protrude outwardly from the front surface and make contact with the chassis into which the mother board is assembled. This provides electromagnetic radiation shielding.


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