Sample processing apparatus and method

Abstract

This invention prevents defects generated when a bonded substrate stack having a separation layer is separated. A bonded substrate stack ( ) having a porous layer ( ) is separated in two steps of the first and second processes. In the first process, a jet is ejected to the porous layer ( ) while rotating the bonded substrate stack ( ) to partially separate the bonded substrate stack ( ) while leaving the central portion of the porous layer ( ) as an unseparated region. In the second process, the jet is ejected to the porous layer ( ) while rotation of the bonded substrate stack ( ) is stopped. A force is applied to the unseparated region from a predetermined direction to completely separate the bonded substrate stack ( ). Also, the first region (peripheral portion) and second region (central portion) of the bonded substrate stack ( ) having the porous layer ( ) are separated using a jet and ultrasonic wave, respectively. More specifically, the first region is separated by a jet ejected from a nozzle ( ) while rotating the bonded substrate stack ( ). On the other hand, the second region is separated by an ultrasonic wave generated by an ultrasonic vibrator ( ).