The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2003
Filed:
Nov. 07, 2001
Lenghways Technology Co., Ltd., Taipei, TW;
Abstract
A micro-electromechanical (MEM) process for fabrication of integrated multi-frequency communication passive components is fused into co-fired ceramics by way of “flip chip” for fabrication of a low-cost, high-performance, and high-reliability hybrid communication passive component applicable in the frequency range of 0.9 GHz˜100 GHz. The basic structure of the passive component is a double-layer substrate comprising a low-loss ceramic or glass bottom-layer substrate and a glass or plastic poly-molecular top-layer substrate and an optional ceramic substrate at the lowest layer. As the materials used and the processing temperature in the MEM process is compatible with the CMOS process, thus this invention is fit for serving as a post process following the CMOS process.