The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2003

Filed:

Aug. 09, 2001
Applicant:
Inventors:

Glenn C. Mandigo, Boothwyn, PA (US);

Ross E. Barker, II, Newark, DE (US);

Craig D. Lack, Wilmington, DE (US);

Ian G. Sullivan, Wilmington, DE (US);

Wendy B. Goldberg, Wilmington, DE (US);

Assignee:

Rodel Holdings, Inc, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/00 ; H01L 2/1302 ;
U.S. Cl.
CPC ...
B44C 1/00 ; H01L 2/1302 ;
Abstract

A method of polishing a wafer in a carrier by a polishing pad, controlling a ratio of platen speed to carrier speed (PS to CS) within a specific range, or controlling a first polishing step with a PS to CS ratio in the range of about 150:1 to about 1:150 followed by a second polishing step with a platen speed of about 0 to 20 rpm while maintaining the carrier speed used in the first polishing step, which maximizes clearing of residual material removed from a patterned wafer surface by polishing.


Find Patent Forward Citations

Mandigo, Glenn. (2003). Chemical mechanical planarization of metal substrates (U.S. Patent No. 6602436). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6602436

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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