The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2003

Filed:

Jun. 29, 2001
Applicant:
Inventors:

Klaus Beyer, Poughkeepsie, NY (US);

Dominic Schepis, Wappingers Falls, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/176 ; H01L 2/100 ; H01L 2/1336 ; H01L 2/13205 ; H01L 2/1302 ;
U.S. Cl.
CPC ...
H01L 2/176 ; H01L 2/100 ; H01L 2/1336 ; H01L 2/13205 ; H01L 2/1302 ;
Abstract

A method is disclosed for forming shallow trench isolation (STI) on a thin silicon-on-insulator (SOI) substrate. The method comprises depositing a first polysilicon layer; depositing a polish stop layer on the first polysilicon layer; forming a plurality of trenches in the substrate; filling the trenches with silicon oxide; CMP polishing a first portion of the silicon oxide layer down to the polish stop layer; etching a second portion of the silicon oxide layer down to below the polish stop layer and above the first polysilicon layer; removing the polish stop layer; depositing a second polysilicon layer; and forming a polysilicon gate comprised of the first and second polysilicon layers. Well ion implants may be performed prior to gate formation, thereby preventing exposure of STI oxide to sacrificial oxide growth and removal, eliminating excessive recess in STI structures. STI oxide seam leakage due to polysilicon sidewalls remaining after polysilicon gate etch are also avoided.


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