The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2003

Filed:

Apr. 06, 2001
Applicant:
Inventors:

Takamitsu Kawahara, Kawasaki, JP;

Hiroyuki Nagasawa, Tokyo, JP;

Kuniaki Yagi, Tokyo, JP;

Assignee:

Hoya Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C30B 2/518 ;
U.S. Cl.
CPC ...
C30B 2/518 ;
Abstract

A process for preparation of silicon carbide by depositing silicon carbide on at least a part of a surface of a substrate having on its surface undulations extending approximately in parallel with each other, wherein a center line average of said undulations is in a range of from 3 to 1,000 nm, gradients of inclined planes of said undulations are in a range of from 1&deg; to 54.7&deg;, and, in a cross section orthogonal to a direction along which the undulations are extended, portions at which neighboring inclined planes are brought in contact with each other are in a curve shape. The substrate is silicon or silicon carbide having a surface with a plane normal in a crystallographic <001> orientation, having &lcub;001&rcub; planes accounting for 10% or less of the entire area of the surface, etc. Also claimed is a single crystal silicon carbide having a planar defect density of 1,000/cm or lower, or having an internal stress of 10 MPa or lower.


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