The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2003

Filed:

Aug. 13, 2001
Applicant:
Inventors:

Jonathon Gerrit Greenwood, Phoenix, AZ (US);

Frank Joseph Juskey, Phoenix, AZ (US);

Assignee:

Amkor Technology, Inc., Chandler, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 2/600 ;
U.S. Cl.
CPC ...
B23K 2/600 ;
Abstract

A method includes modifying wettable regions of a leadframe with a laser to form non wettable barriers. Wettable pads are defined with the non wettable barriers. Since the non wettable barriers are formed in a single automated step with the laser, the non wettable barriers are formed at low cost. During flip chip mounting of an electronic component to the leadframe, the non wettable barriers confine solder to the wettable pads. This results in consistent and reliable solder bump formation.


Find Patent Forward Citations

Quick Actions:

Greenwood, Jonathon. (2003). Laser defined pads for flip chip on leadframe package fabrication method (U.S. Patent No. 6593545). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6593545

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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