The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2003
Filed:
Nov. 27, 2000
David Weston Haggart, Jr., Scottsdale, AZ (US);
Walter Glashauser, Unterhaching, DE;
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method for determining an endpoint during chemical-mechanical polishing of a semiconductor wafer ( ) is disclosed. The method comprises the steps of depositing on a first layer ( ) to be polished a second layer ( ), the physical properties of the first layer ( ) being different from the physical properties of the second layer ( ). After that, the wafer ( ) is polished by chemical-mechanical polishing. Due to the different physical properties of the layers, a variation of the physical properties can be detected, and an endpoint can be determined on the basis of the detected variation. Further, a semiconductor wafer for use in a chemical-mechanical polishing process is disclosed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile