The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2003
Filed:
May. 08, 2001
Applicant:
Inventor:
Matthew Ryskoski, Kyle, TX (US);
Assignee:
Advanced Micro Devices, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/14763 ;
Abstract
An apparatus and method are capable of a process to planarize a surface of a conductive layer on a semiconductor wafer. The method includes bringing a temperature of the conductive layer to within a predetermined range below a melting point of the conductive layer and holding the temperature of the conductive layer within the predetermined range to allow the conductive layer to undergo strain via at least one creep mechanism due to a weight of the conductive layer. The conductive layer is then cooled.