The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2003

Filed:

Dec. 28, 2000
Applicant:
Inventors:

Anwar Ali, London, GB;

Mike Teh-An Liang, Milpitas, CA (US);

Bing Yi, Sunnyvale, CA (US);

Assignee:

LSI Logic Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/750 ;
U.S. Cl.
CPC ...
G06F 1/750 ;
Abstract

A method for making a bump and trace layout for an integrated circuit die includes the step of replicating a routing tile having a first column of I/O pads and a second column of I/O pads wherein the first column is offset from the second column so that the I/O pads of the first column are interleaved between the I/O pads of the second column.


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