The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2003

Filed:

Jul. 19, 1999
Applicant:
Inventors:

Masaru Takada, Ogaki, JP;

Kiyotaka Tsukada, Ogaki, JP;

Hiroyuki Kobayashi, Ogaki, JP;

Hisashi Minoura, Ogaki, JP;

Yoshikazu Ukai, Ogaki, JP;

Mitsuhiro Kondo, Ogaki, JP;

Assignee:

Ibiden Co., Ltd., Ogaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 ;
U.S. Cl.
CPC ...
H05K 1/11 ;
Abstract

In the production of a printed wiring board comprising innerlayer conductor circuits arranged among insulating layers and blind via-holes formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole is previously formed in a central portion of the innerlayer conductor circuit located at the bottom of the blind via-hole , and laser beams are irradiated from the outermost surface of the insulating layer to form the blind via-holes . Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits and the blind via-holes


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