The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2003
Filed:
Jun. 29, 2001
Kristopher Frutschy, Phoenix, AZ (US);
Glenn E. Stewart, Mesa, AZ (US);
Farzaneh Yahyaei-Moayyed, Chandler, AZ (US);
Geoffery L. Reid, Mesa, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An electronic assembly includes one or more conductive clamps ( FIG. 3), which are used to supply current to an integrated circuit (IC) package ( ). The conductive clamps are attached to a printed circuit (PC) board ( ), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad ( ) on the surface of the PC board, and contacts another contact pad ( ) on the top surface of the IC package. Vias ( ) and conductive planes ( ) within the package then carry current to and from an IC (e.g., IC ) connected to the package. In another embodiment, the clamp ( FIG. 9) holds a conductive structure ( ) in place between the PC board contact pad ( ) and the IC package contact pad ( ), and current is carried primarily over the conductive structure, rather than over the clamp.