The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2003

Filed:

Nov. 27, 2001
Applicant:
Inventors:

Hung-Wen Chiou, Hsinchu, TW;

Chia-Chun Tso, Taipei Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/166 ;
U.S. Cl.
CPC ...
H01L 2/166 ;
Abstract

The present invention provides a method of tool matching for a semiconductor manufacturing process having a first and second path completed by serial combinations of tools for processing of wafers. The method comprises the steps of providing a target value, obtaining a first and second test result of the wafers processed through the first and second path respectively, calculating differences between the first and second test result and the target value to obtain a first and second estimate respectively, and selecting one of the first and second paths according to the estimates.


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