The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2003
Filed:
Oct. 30, 2000
Toshihiko Ishikawa, Mitaka, JP;
Yasushi Katagiri, Mitaka, JP;
Tokyo Seimitsu Co., Ltd., Tokyo, JP;
Abstract
In a process of manufacturing semiconductor chips, first, the reverse of a wafer, on the obverse of which many chips are formed, is ground so as to shape the wafer with a predetermined thickness. Then, the reverse of the wafer is polished or etched so that the broken layer which is formed during the back grinding is removed. Next, grooves are formed on the reverse of the wafer in a predetermined depth along streets formed between the chips. Finally, the wafer is cleft along the grooves so as to be divided into separate chips. By this process, the broken layer formed on the reverse of the wafer is removed after the back grinding, then the wafer is divided into separate chips by use of the cleavage; therefore, chipping is effectively reduced.