The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2003

Filed:

Oct. 11, 2001
Applicant:
Inventors:

Chun-Yen Huang, Chu-Bei, TW;

Chien-Ye Lee, Taipei, TW;

Ju-Bin Fu, Hsinchu, TW;

Rong-I Peng, Miaoli, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3544 ; H01L 2/1301 ;
U.S. Cl.
CPC ...
H01L 2/3544 ; H01L 2/1301 ;
Abstract

High contrast alignment marks that can be flexibly located on a semiconductor wafer are disclosed. The wafer has a first layer and a second layer. The first layer has a light-dark intensity and a reflectivity. The second layer is over the first layer, and has a light-dark intensity substantially lighter than that of the first layer, and a higher reflectivity than that of the first layer. The first layer may be patterned to further darken it. The second layer contrasts visibly to the first layer, and is patterned to form at least one or more alignment marks within the second layer. The first layer may be a metallization layer, such as titanium nitride, whereas the second layer may be a metallization layer, such as aluminum or copper.


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