The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2003
Filed:
Jul. 24, 2001
Kazushi Takahashi, Tokyo, JP;
Hiroshi Ohuchi, Tokyo, JP;
Senju Metal Industry, Co., Ltd., Tokyo, JP;
Abstract
An automated soldering apparatus includes a conveyor for transporting a printed circuit board along a predetermined path, a fluxer located below the conveyor for coating the circuit board and the electronic components with flux, and a preheater located downstream of the fluxer for heating the circuit board and the electronic components to a predetermined temperature. A molten solder bath is provided downstream of the preheater for applying a molten solder to selected areas of the circuit board. A cooling assembly is arranged downstream of and adjacent to the molten solder bath. The cooling assembly is operable to cool the applied molten solder at a rate of approximately as high as 1.0° C. per second until the molten solder reaches its solidus temperature.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile