The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2003
Filed:
Jun. 02, 2000
Ying Chou Tsai, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung Hsien, TW;
Abstract
A semiconductor package structure for Flip Chip package includes at least an insulative core layer and a plurality of patterned circuit layers alternately stacking up each other. The patterned circuit layers are electrically connected each other wherein one of the patterned circuit layers is positioned on the surface of the substrate. The patterned circuit layer includes a plurality of bump pads, and each of the bump pads has an etching hole. The solder mask layer covers the surface of the patterned circuit layer and a portion of the surface of the outer edge of the bump pads, and exposes the etching holes. The solder mask layer may also expose the whole surface of the bump pads.