The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2003
Filed:
May. 01, 2001
Nae Hak Park, Seoul, KR;
Hyundai Electronics Industries Co., Ltd., Kyoungki-do, KR;
Abstract
The method of forming a plug of a semiconductor device includes sequentially forming a conductive film and an insulation film over a semiconductor substrate having a high density region and a low density region. The high density region has a greater number of structures formed thereover than the low density region. Next, a first CMP (chemical mechanical polishing) process, in which slurry for removing insulating film is used, is performed to selectively remove the insulating film and expose a top surface of the conductive film. Then a second CMP process, in which slurry for removing conductive film is used, is performed to selectively remove the conductive film and the insulating film and expose structures in the high density region.