The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2003
Filed:
Jan. 18, 2002
Applicant:
Inventor:
Sudipto R. Roy, Singapore, SG;
Assignee:
Chartered Semiconductor Manufacturing Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F 1/00 ;
U.S. Cl.
CPC ...
C23F 1/00 ;
Abstract
A new method is provided for the polishing of semiconductor surfaces such as the surface of a substrate, the surface of deposited copper and the surface of low-k layers of dielectric. The polishing method and apparatus of the invention comprise a new slurry delivery design whereby at least two different slurries can be independently controlled and mixed for delivery to a slurry container. The slurry container is in direct physical contact with a polishing pad, providing for the mixed slurry to be distributed over the surface of the polishing pad.